As 5G technology requires high-frequency bandwidth, multi-connection and low-latency chips, as well as the high computational power required for AI artificial intelligence. Advanced packaging technology, which provides high-density interconnections by integrating multiple Chiplet into one package, will be a trend in the future.

Expert place greater emphasis than ever before on the power integrity (PI), signal integrity (SI), electromagnetic compatibility (EMC) and thermal issues that arise, and provide corresponding solutions.